They introduce a conveyance carrier using the adhesion resin which is usable 1,000 times repeatedly and is strong in heat. It is used for FPC board implementation, microparts and board conveyance
WebSite：
http://www.kyosha.co.jp/ [toggle_box][toggle_item title="Script" active="false"]
It is Kyosya Co., Ltd.
This product is MagiCarrier.
This product is a board for conveyance using the adhesive strength.
This is a dummy film, but adhesion resin is applied to this board.
Please use it to stick flex board,
lightweight thin parts or microparts on this board.
I explain the main usage.
For example, in the case of the implementation process of the flex board, I stick flex board on this board.
I do the mount implementation of printing the cream solder and parts.
This resin in itself has heat resistance of around 260-280 degrees.
I just put it in a furnace of the reflow.
I sticks the thin flex board which is hard to treat
or a thin ceramic substrate on the rigid board.
It can expect improvement of conveyence and the productivity of the process, improvement of the quality by managing this.
There are S type, corresponding to flex board and polish surface work, and a weak adhesion type.
And there are strong M type of the adhesive strength, H type, 3H type.
This has the very strong adhesion.
The boards which is hard to stick,
such as with the porous surface structure or ceramic substrate can process flow using the strong adhesiveness.
The most characteristic of the product is
the heat resistance in comparison with normal adhesive tape, and usable repeatedly.
When it is a reflow process, around 1000 times it can usually flow.
People fixed a board with disposable polyimide tape so far.
It can expect the effect of the reduction in cost very much in comparison with that, too.
With the above, I finish the explanation of our product.Thank you.
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"JPCA Show 2014" （44th International Electronic Circuits Exhibition） covered all a product and technical service about production and the development of the electronic circuit.
The theme of this year is that "pick up, tie, make and widen every product abd technique."
As for the co-exhibition, "Large Electronics Show 2014", "WIRE Japan Show 2014" (Electric wire, Cable, and Connector Exhibition), "2014 Microelectronics Show" (28th Advanced Electronics Packaging Exhibition), "JISSO PROTEC 2014" (16th Jisso Process Technology Exhibition) is held.
A session is three days of Friday for from Wednesday, June 4, 2014 to 6th. The venue is Tokyo Big Sight.
The official homepage of JPCA Show 2014:
http://www.jpcashow.com/show2014/index.php
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